Semiconductor device
US10211116B2 · kind B2 · utility
0Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 26, 2016 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | May 26, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device according to the present invention includes a mounting section provided with a chip mounting region for mounting a semiconductor chip, a frame provided in the mounting section so as to surround the chip mounting region, a cap disposed in contact with the frame so as to cover a space surrounded by the chip mounting region and the frame and a joint that joins the frame and the cap outside a contact surface between the frame and the cap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.