Semiconductor device
US10211135B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 15, 2017 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Jun 15, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2018
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor element, a circuit board, metal wires, and an expanding member. The circuit board has an upper surface and a lower surface opposite the upper surface. The metal wires are formed on at least one of the upper surface and the lower surface. At least two connection terminals are formed in a terminal formation surface of the semiconductor element which is disposed so as to face the upper surface of the circuit board. The expanding member is fixed to the terminal formation surface of the semiconductor element, has a larger coefficient of linear thermal expansion than the semiconductor element, and has a size larger than the interval between adjacent two of the at least two connection terminals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.