Light emitting device package assembly and method of fabricating the same
US10211186B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2016 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Jul 27, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8515
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A light emitting device package assembly including a first substrate, a plurality of light emitting device packages disposed on the first substrate, and a light conversion member disposed on the light emitting device packages. Each of the light emitting device packages includes a main body disposed on the first substrate and including a first cavity, a light source disposed in the first cavity, and a first matrix disposed in the first cavity. Further, the light conversion member includes a second substrate including a plurality of second cavities, a second matrix disposed in the second cavities, and first light conversion particles disposed in the second matrix.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.