Method for manufacturing light-emitting diode package
US10211377B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2015 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Mar 25, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
Abstract
The present invention relates to a method for manufacturing a light-emitting diode package, and more specifically to a method for manufacturing a light-emitting diode package that does not need an additional color conversion frit heat-treatment process and cutting process after bonding between the color conversion frit and a light-emitting diode chip. To this end, the present invention provides a method for manufacturing a light-emitting diode package characterized in that the present invention comprises: a color conversion frit formation step for forming a color conversion frit in which phosphor is included on a substrate; a color conversion frit transcription step for transcribing the color conversion frit formed on the substrate from the substrate to a transcription film; and a color conversion frit bonding step for bonding the color conversion frit transcribed on the transcription film onto a light-emitting diode package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.