3D RF-substrate patterning
US10211497B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | May 22, 2017 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Oct 10, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01P11/003
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A microstrip transmission line comprising a dielectric substrate including a series of periodic sinusoidal undulation portions defining spaced apart peaks and troughs, where a distance between the peaks and troughs defines a period of the microstrip line, and where each peak defines a maximum height of the substrate and each trough defines a minimum height of the substrate. The transmission line further includes a conductive strip formed to a surface of the substrate so that the conductive strip follows the undulation portions. The conductive strip includes a modulation portion in a width direction of the conductive strip perpendicular to a signal propagation direction along the strip, where the modulation portion includes a minimum width portion provided at each peak and a maximum width portion provided at each trough so that a variation of a ratio between the width of the conductive strip and the height of the substrate is maximized.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.