Electronic device with laterally extending thermally conductive body and related methods
US10212804B2 · kind B2 · utility
0Cited by
9References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2017 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Mar 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10416
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device may include a circuit board, an IC carried by the circuit board, and an RF shield above the IC. The circuit board may include a dielectric layer, and a thermally conductive body in the dielectric layer. The thermally conductive body may have a first heat transfer surface coupled to the IC. The thermally conductive body may extend laterally within the dielectric layer and outward past the RF shield and defining a second heat transfer surface. The electronic device may include a heat sink coupled to the second heat transfer surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.