Gold-plating etching process for 5G communication high-frequency signal boards
US10212824B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2018 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Feb 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0338
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A gold-plating etching process for 5G high-frequency signal boards is carried out according to the following steps: the outer dry film, the plug gold-plating, the film removing, and the alkaline etching. The alkaline etching solution comprises 100 to 150 g/L of cupric chloride, 90 to 120 g/L of ammonium chloride, and ammonia. The pH value is 9.6 to 9.8. The ratio of the ammonia and the alkaline etching solution is (550-800):1000. The present invention provides a gold-plating etching process of 5G high-frequency signal boards. The alkaline etching procedure is performed right after gold-plating, eliminating the outer etching process after gold-plating. Costs of the outer film pressing, the exposure, and the development can be saved. The flow rate is improved. Requirements of 5G communication circuit boards are satisfied. That is, the transmission speed of 5G communication high-frequency signal boards of the present invention is fast.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.