Electrical bushing with contact element and method for the production

US10212836B2 · kind B2 · utility

Assignee

• HERAEUS DEUTSCHLAND GMBH & CO. KG · DE

Inventors

• Robert Dittmer · Hanau, DE
• Frank Krüger · Könnern, DE

Key dates

• Filing date: Jan 19, 2018
• Grant date: Feb 19, 2019
• Expiry date: Jan 19, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K5/0095
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

One aspect relates to an electrical bushing for a medically implantable device, including an electrically insulating base body and an electrical conducting element. The conducting element includes a cermet, and the base body and the conducting element are connected by a sintered bond with a hermetic seal against the base body. The conducting element extends from a first surface of the base body through the base body to a second surface of the base body. The conducting element has first and second electrically conductive areas, and at least one of the electrically conductive areas is at least partially superimposed by a layer-like contact element, including a metal, so that the conducting element is connected in an electroconductive manner via the contact element. The contact element is an electrochemically created layer, such that it has a porous structure, wherein the porosity of the contact element is not more than 20%.