Cooling mechanism of high mounting flexibility
US10212859B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2015 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Mar 25, 2036 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2275/14
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.