Partial encapsulation of stents
US10213328B2 · kind B2 · utility
0Cited by
314References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2013 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Jul 26, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/109
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
A method of making an implantable medical device includes extruding a first ePTFE tube and a second ePTFE tube, cutting a plurality of slits in the first ePTFE tube, positioning a radially expandable support layer between the first and second ePTFE tubes so that the slits span portions of the support layer, and laminating the first ePTFE tube to the second ePTFE tube through openings in the support layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.