Machining head and machining device
US10213872B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 2, 2015 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Dec 4, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K37/003
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A processing head (1) for surface processing by means of a laser beam is disclosed. The processing head (1) comprises a through passage (2) for a laser having a longitudinal axis (A), at least one powder supply passage (3) and a cooling passage (4) for cooling the processing head (1). The processing head (1) is at least configured of two parts and comprises a body (5) and a sleeve (6). The sleeve (6) is suitable for the arrangement at the body (5). The through passage (2) of the laser and the powder feed channel (3) are configured in the body (5). The body (5) at least partly forms a first sidewall of the cooling passage (4). The sleeve (6) at least partly forms a second sidewall of the cooling passage (4).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.