Three dimensional printing adhesion reduction using photoinhibition
US10213956B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2018 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | May 18, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB33Y30/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods, systems, and apparatus, including medium-encoded computer program products, for three dimensional print adhesion reduction using photoinhibition include, in one aspect, a method including: moving a build plate in a vat of liquid including a photoactive resin; creating a photoinhibition layer within the liquid directly adjacent a window of the vat by directing a first light through the window into the liquid, the first light having a first wavelength selected to produce photoinhibition; and creating a solid structure on the build plate from the photoactive resin within a photoinitiation layer of the liquid by directing a second light through the window into the liquid, where the photoinitiation layer resides between the photoinhibition layer and the build plate, and the second light has a second wavelength different than the first wavelength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.