High content polyamide hot-applied thermoplastic composition
US10214649B2 · kind B2 · utility
2Cited by
12References
19Claims
0Family size
Inventors
Key dates
| Filing date | Sep 5, 2017 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Sep 5, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K7/20
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A hot-applied thermoplastic pavement marking composition comprising a modified polyamide resin in the range of between 3 and 10 percent by weight, rosin-modified esters, a copolymer, 30-70 percent by weight of a glass bead intermix, a range of between 1 and 15 percent by weight of either white or yellow pigment, and one or more plasticizers, inorganic fillers, waxes, antioxidants or light stabilizers, and methods of applying a hot-applied thermoplastic pavement marking composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.