Patent · US Active

Adhesive composition and article including the same

US10214668B2 · kind B2 · utility

0Cited by
23References
18Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 8, 2015
Grant dateFeb 26, 2019
Priority date
Expiry dateFeb 4, 2036

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC09J2479/023
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

An adhesive composition (“composition”) comprises an epoxy resin, a binder, and a curing agent. Typically, the composition further comprises an aqueous solvent (e.g. water) such that the composition can be referred to as an aqueous adhesive composition. The epoxy resin is typically encapsulated to prevent premature cure of the composition. After rupture of the encapsulated epoxy resin, the composition cures to form an adhesive. The composition is useful for articles such as fasteners (e.g. nuts and bolts) such that it can be referred to as a fastener adhesive. Typically, the composition is disposed on a threaded surface of the fastener. The fastener can be used for an assembly in which the composition generally cures after installation of the fastener. To make the fastener, the adhesive composition can be applied on the threaded surface. After application, the composition can be dried in instances where the composition still includes the aqueous solvent.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.