Method of depositing one or more layers of microspheres to form a thermal barrier coating
US10214825B2 · kind B2 · utility
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3References
19Claims
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Inventor
Key dates
| Filing date | Dec 29, 2016 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Dec 29, 2036 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D7/00
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of forming a thermal barrier coating onto a surface of a ferrous alloy or nickel alloy component part involves depositing a layer of hollow microspheres to a surface of the component part or to a previously deposited layer of hollow microspheres through heating and cooling of a metallic precursor setting layer composed of copper, a copper alloy, or a nickel alloy. Once deposited in place, the layer(s) of hollow microspheres are heated to sinter the hollow microspheres to each other and to the surface of the ferrous alloy or nickel alloy component part to form an insulating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.