Methods of fabricating and operating a solid-state zinc sensor
US10215727B2 · kind B2 · utility
1Cited by
1References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 2, 2017 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Nov 2, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2800/28
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments of the invention are directed to a solid-state zinc sensor. A non-limiting example of the sensor includes a semiconductor substrate. The sensor can also include an assembly surface on the semiconductor substrate. The sensor can also include a zinc detection monolayer chemically bound to the assembly surface. The sensor can also include a power supply electrically connected to the semiconductor substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.