System and method for thermal management guidance
US10216237B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 2, 2017 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Oct 2, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C73/10
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The present disclosure describes one or more systems, methods, routines and/or techniques for thermal management. One or more systems, methods, routines and/or techniques may provide advice or guidance (e.g., to a repair technician) regarding how to perform a hot bond repair, for example, on an aircraft component that has been damaged. The thermal management advisor may provide advice or guidance regarding how to prepare a repair field prior to running a thermal survey. For example, thermal management advisor may recommend a particular heat blanket, a configuration of the heat blanket, placement of various temperature sensors and other preparation guidance. The thermal management advisor may provide advice or guidance regarding how to alter or manage the repair setup during a thermal survey and during the actual curing process. For example, thermal management advisor may recommend particular temperature sensors or areas of the repair field that should be insulated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.