Mounted semiconductor module with a mold resin portion
US10217683B2 · kind B2 · utility
0Cited by
8References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 13, 2015 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | May 13, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH02P27/06
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module is provided in which a semiconductor element is mounted and a plurality of outside connecting modules are drawn from a side of a mold resin portion. To ensure sufficient space for a holding tool used in mounting the semiconductor module to a device with a simple structure, holding side portions are provided for at least two opposing corner portions of corner portions between adjacent sides of the mold resin portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.