Apparatus for micro pick and bond
US10217729B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 30, 2016 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Sep 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H29/142
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Embodiments of the invention include systems and methods for transferring micro LEDs. In an embodiment, the system for transferring micro LEDs, may include a donor substrate bank that is capable of supporting a plurality of donor substrates on which a plurality of micro LEDs are formed. In an embodiment, the donor substrate bank is moveable in the X, Y, and Z directions. In an embodiment, the system may also include a host substrate table that is capable of supporting a host substrate. The host substrate may include a plurality of segments. In an embodiment, the host substrate table is moveable in the X, Y, and Z directions. Embodiments of the invention may also include an array of macro transfer heads. In an embodiment, each macro transfer head may include a plurality of micro transfer heads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.