Semiconductor device, method for manufacturing semiconductor device, inverter circuit, driving device, vehicle, and elevator
US10217811B1 · kind B1 · utility
2Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 9, 2018 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Feb 9, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/661
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device according to an embodiment includes a silicon carbide layer having a front surface inclined at 0° or more and 10° or less with respect to a (0001) face, a silicon oxide layer, and a region located between the front surface and the silicon oxide layer and having the number of carbon-carbon single bonds larger than the number of carbon-carbon double bonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.