Patent · US Active

Method for producing optoelectronic semiconductor devices and optoelectronic semiconductor device

US10217913B2 · kind B2 · utility

7Cited by
0References
9Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 30, 2014
Grant dateFeb 26, 2019
Priority date
Expiry dateOct 30, 2034

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10H20/854
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The invention relates to a method for producing a plurality of optoelectronic semiconductor components, comprising the following steps: preparing a plurality of semiconductor chips spaced in a lateral direction to one another; forming a housing body assembly, at least one region of which is arranged between the semiconductor chips; forming a plurality of fillets, each adjoining a semiconductor chip and being bordered in a lateral direction by a side surface of each semiconductor chip and the housing body assembly; and separating the housing body assembly into a plurality of optoelectronic components, each component having at least one semiconductor chip and a portion of the housing body assembly as a housing body, and each semiconductor chip not being covered by material of the housing body on a radiation emission surface of the semiconductor component, which surface is located opposite a mounting surface. The invention also relates to a semiconductor component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.