Bidirectional and uniform cooling for multiple components in a computing device
US10219365B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 2018 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Feb 23, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/467
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit card assembly includes a circuit card, a plurality of components disposed on a first surface of the circuit card in a shadow arrangement, and a plurality of air-cooled heat sink structures disposed on each of the components. Each of the plurality of heat sink structures comprises a plurality of impedance zones arranged in series substantially perpendicular to the airflow path, where the plurality of impedance zones comprise a first impedance zone having a first air impedance, and a second impedance zone having a second air impedance less than the first air impedance. Further, the plurality of zones in the plurality of heat sink structures are aligned so that the first impedance zone in one of the plurality of heat sink structures does not overlap with the first impedance zone in another of the plurality of heat sink structures, relative to the airflow path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.