Laminated light guide and carrier having a circuit board with light emitting diodes and through bores with a light guide disposed therein with an opaque film overlapping the through bore
US10219368B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2017 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Dec 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10106
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A laminated light guide and component carrier includes a printed circuit board having a light emitting diode connected to a first face of the printed circuit board. A through bore is created in the printed circuit board proximate to the light emitting diode. An opaque film is applied using an adhesive to a second face of the printed circuit board oppositely directed with respect to the first face, the opaque film having a portion overlapping the through bore. A light guide is positioned within the opening and affixed to the portion of the opaque film overlapping the through bore. A white film is applied or ink printed onto the light guide without contacting the first face of the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.