Device for terminal heat dissipation and mobile terminal
US10219410B2 · kind B2 · utility
2Cited by
2References
18Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Nov 10, 2014 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Nov 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04W88/02
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
The disclosure discloses a device for terminal heat dissipation and a mobile terminal, including: a heat source chip, a heat pipe, and a shield, wherein the shield is located between the heat source chip and the heat pipe, and is connected with the heat source chip and with the heat pipe via the same type of flexible thermal conductive solid; and a microporous array is arranged at a connection position between the flexible thermal conductive solids, which are in contact with the shield.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.