Machines for the separative machining of plate-shaped workpieces

US10220475B2 · kind B2 · utility

Assignee

• TRUMPF Werkzeugmaschinen GmbH + Co. KG · DE

Inventors

• Frank Schmauder · Metzingen, DE
• Simon Ockenfuss · Eppelheim, DE
• Peter Epperlein · Ditzingen, DE
• Magnus Deiss · Stuttgart, DE
• Dennis Wolf · Westlake, US
• Johannes Krampfert · Ditzingen, DE

Key dates

• Filing date: Jun 20, 2016
• Grant date: Mar 5, 2019
• Expiry date: Sep 1, 2037

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B26F3/008
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

The invention relates to machines and methods for separative machining of a plate-shaped workpiece by a processing beam. The machines include a first movement unit configured to move the workpiece in a first direction and a second movement unit configured to move a machining head configured to emit the processing beam. The second movement unit is configured to move the machining head in a second direction perpendicular to the first direction to direct the processing beam onto the workpiece. The machines include a first workpiece support unit including a first workpiece-bearing face and a second workpiece support unit including a second workpiece-bearing face spaced apart by a gap from the first workpiece support unit and the first workpiece-bearing face. The gap extends along the second direction. The machines include at least two support slides configured to move in the gap in the second direction mutually independent of one another.