Patent · US Active

Lamination transfer films for forming reentrant structures

US10220600B2 · kind B2 · utility

0Cited by
13References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 9, 2015
Grant dateMar 5, 2019
Priority date
Expiry dateJan 9, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10K2102/331
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

Transfer films comprising a carrier film, a sacrificial template layer deposed on the carrier film and comprising reentrant forming template features, and a thermally stable backfill layer having a first surface conforming to the reentrant forming template features and forming reentrant features and an opposing planar second surface; and methods of making transfer films are disclosed.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.