Lamination transfer films for forming reentrant structures
US10220600B2 · kind B2 · utility
0Cited by
13References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 9, 2015 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Jan 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/331
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Transfer films comprising a carrier film, a sacrificial template layer deposed on the carrier film and comprising reentrant forming template features, and a thermally stable backfill layer having a first surface conforming to the reentrant forming template features and forming reentrant features and an opposing planar second surface; and methods of making transfer films are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.