Patent · US Active

Anodic bonding of thermally stable polycrystalline materials to substrate

US10221630B2 · kind B2 · utility

0Cited by
2References
16Claims
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Key dates

Filing dateSep 11, 2014
Grant dateMar 5, 2019
Priority date
Expiry dateNov 10, 2035

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB22F2005/001
  • WIPO fieldMaterials, metallurgy
  • WIPO sectorChemistry

Abstract

Cutting elements and other hardfacing components of a drill bit or other downhole equipment are provided that include a thermally stable polycrystalline material anodically bonded to a substrate. Methods and systems for making such elements and components are also provided.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.