Method of applying an electroplated layer to a polymeric composite material
US10221704B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 1, 2016 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Mar 16, 2037 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05D2300/603
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of applying an electroplated layer to a surface of a polymeric composite material, the method includes the steps of: providing an uncured polymeric composite substrate; positioning a veil layer over a surface of the uncured polymeric composite substrate, the veil layer providing a conductive surface on the uncured polymeric composite substrate, the veil layer having a mat of metal coated fibres consolidated by an organic binder material; subjecting the uncured polymeric composite substrate to a curing cycle to form a cured polymeric composite material in which the veil layer is partially exposed; and applying an electroplated layer to the conductive surface of the cured polymeric composite material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.