Heat exchange device
US10222133B2 · kind B2 · utility
0Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 2015 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Jan 17, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/14
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A heat exchange device having a thermally conductive substrate, an intermediate layer, and an adsorbent material. The intermediate layer at least partially covers the thermally conductive substrate. A plurality of openings is formed at a surface of the intermediate layer. The openings have an elongated shape in a direction from an outer surface of the intermediate layer towards the thermally conductive substrate, and the adsorbent material at least partially fills the plurality of openings.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.