Platinum temperature sensor element
US10222248B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2017 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Oct 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/20
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Internal electrodes, a protective film, and protective films covering the top parts of internal electrode sides of lead wires are formed on a top surface of a substrate of a temperature sensor element, thereby making the overall shape a quadrangular prism and the transverse cross-section nearly a square even at any portion in the axial direction. A heating part of the temperature sensor element is provided near the center along the length, the height, and the width of the element, thereby preventing deviation of heat generation and stabilizing heat release to the lead wires. This allows the temperature sensor element to suppress fluctuation in detected temperatures due to mounting angle.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.