Computer-aided resin behavior analyzer
US10223481B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2016 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Feb 19, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2113/26
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
In a computer-aided resin behavior analyzer that analyze behavior of a continuous fiber and long discontinuous fiber incorporated in a resin during molding in a mold under predetermined molding conditions through a simulation program installed on a computer, the simulation program is configured to calculate, when analysis conditions including at least multiple nodes F of the fiber is inputted, a bending rate Af of the fiber with respect to an evaluated length obtained from at least one node Fn among multiple nodes F anticipated under the molding conditions based on the analysis conditions, and to evaluate bending of the fiber based on the bending rate Af with respect to the evaluated length.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.