Spice model bin inheritance mechanism
US10223484B1 · kind B1 · utility
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20Claims
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Key dates
| Filing date | Mar 31, 2014 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Feb 13, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/367
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system, method, and computer program product for facilitating model binning in circuit simulators. Embodiments enable specification of models spanning binning dimensions, such as device width and length, in a model group via inheritable model bins. New simulator modeling syntax and semantics eliminate much of the redundancy and parsing overhead from model parameter specifications in foundry process design kits. Indirect and optional inheritance is also enabled, allowing for fine grain and coarse grain grids in the same model group.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.