De-bouncing keypad and preparation method thereof
US10224156B2 · kind B2 · utility
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1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 15, 2015 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Aug 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H2229/014
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention discloses a de-bouncing keypad and a preparation method thereof, wherein the keypad is composed of a rubber substrate and a metal contact having three layers of layered structures. A layer of tin alloy or lead alloy is plated on a surface of the metal contact by electroplating or chemical plating. The metal contact plated with the tin alloy or lead alloy has excellent contact bouncing resistance and arc-ablation resistance, and the metal contact is further composited with the rubber to shape and prepare the rubber de-bouncing keypad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.