Electrostatic chucks and substrate processing apparatus including the same
US10224228B2 · kind B2 · utility
4Cited by
10References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2017 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Feb 6, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/334
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate processing apparatus includes an electrostatic chuck which is made up of a base, a dielectric plate on the base, a chuck electrode in the dielectric plate, and a first heater section in the dielectric plate between the chuck electrode and the base. The first heater section includes first heaters that are separated from each other in a first direction, and respective first upper plate electrodes disposed between the first heaters and the base. The first upper plate electrodes are separated from each other in the first direction and respectively connected to the first heaters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.