Manufacturing method for an array substrate
US10224353B2 · kind B2 · utility
Assignees
Inventor
Key dates
| Filing date | Jan 10, 2017 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Jan 10, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed are an array substrate, a manufacturing method thereof, a sensor and a detection device. The array substrate includes: a base substrate; a thin-film transistor (TFT) being disposed on the base substrate and including a source electrode and an active layer; a passivation layer disposed on the TFT; a first metal layer disposed on the passivation layer; an insulating layer disposed on the first metal layer; a through hole structure running through the insulating layer, the first metal layer and the passivation layer; and a detection unit being disposed on the insulating layer and including a second metal layer, wherein the second metal layer makes direct contact with the source electrode via the through hole structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.