Contact arrangement for a multi-layer circuit board
US10225926B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 24, 2013 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Jul 31, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10295
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention relates to a contact arrangement (30) for a multi-layer circuit board (1a), said circuit board (1a) having at least one inner wire (2) which is contacted via at least one cutout (10). According to the invention, at least two cutouts (10) are arranged on different sides of the at least one inner wire (2), the center axes (2) of the at least two cutouts (10) having a predefined distance (as) to a target center line (2.4) of the at least one inner wire (2). The at least two cutouts (10) expose the at least one inner wire (2) in at least two contact zones (2.1) for the purpose of contact, said contact zones being arranged on different sides of the wire (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.