Structure of substrate having electronic parts mounted thereon and case for housing the substrate
US10225927B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2016 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Nov 25, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10409
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate provided in proximity to a case for improving heat radiation, and maintaining electrical insulation between the substrate and the case even when the substrate is warped, in the substrate having electronic parts mounted thereon and a case for housing the substrate. A case body of the case has a substrate placement surface for placing the substrate, the substrate placement surface is provided with a protruding portion protruding therefrom, and the substrate is fixed on the substrate placement surface, via a thermal interface material disposed on the substrate placement surface from a periphery of the protruding portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.