Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board
US10225931B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 1, 2016 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Jun 1, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/095
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
According to an embodiment of the present invention, a substrate for a printed circuit board, the substrate including a resin film and a metal layer deposited on at least one surface of the resin film, includes a modified layer on the surface of the resin film on which the metal layer is deposited, the modified layer having a composition different from another portion, in which the modified layer contains a metal, a metal ion, or a metal compound different from a main metal of the metal layer. The content of a metal element of the metal, the metal ion, or the metal compound on a surface of the modified layer is preferably 0.2 atomic % or more and 10 atomic % or less.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.