Thermal transfer between electronic device and case
US10225954B2 · kind B2 · utility
5Cited by
1References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2017 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Sep 25, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/4691
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device case with a thermal dissipation system is disclosed. The electronic device case is configured to draw heat out of an electronic device disposed therein. The electronic device case includes a connector plug configured to engage a connector receptacle of the electronic device. The thermal dissipation system includes a thermally conductive pathway that both transfers heat to a heat spreader and electrically couples the electronic device to an electrical component within the electronic device case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.