Component shielding structures with magnetic shielding
US10225964B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 29, 2016 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Aug 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Electrical components may be shielded using a shielding can or other shielding structure that covers the electrical components. The electrical components and the shielding structure may be mounted on a substrate such as a printed circuit board using solder or other conductive material. The shielding structure may have one or more shielding layers. The shielding layers may include high conductivity material for providing shielding for radio-frequency electromagnetic interference and magnetic material for blocking magnetic flux. Shielding structures may be formed from materials such as ferritic stainless steel, coatings that enhance solderability, corrosion resistance, and conductivity, magnetic materials printed or otherwise formed on metal layers, and other shielding structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.