Pressure sensing implant
US10226218B2 · kind B2 · utility
13Cited by
18References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 17, 2014 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | May 17, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10371
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A wireless circuit includes a housing having at least one opening, and sensor connected to the housing at the opening. The sensor includes a first layer having a first dimension and a second layer having a second dimension shorter than the first dimension. The second layer may be positioned entirely within the housing and a surface of said first layer may be exposed to an exterior of the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.