Flow medium
US10226902B2 · kind B2 · utility
0Cited by
2References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 2012 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | Mar 18, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B30/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A flow medium for distributing a resin in vacuum assisted resin transfer molding processes for manufacturing long, thick and more complex composite parts comprises a flow channel encapsulated by a layer of fibrous material, which provides a high volume flow of resin distributed in a timely manner in the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.