Thermoplastic resin composition and molded article using the same
US10227489B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2017 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | Dec 27, 2037 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2207/53
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed are a thermoplastic resin composition including (A) about 100 parts by weight of a base resin including (A-1) about 65 wt % to about 85 wt % of a polycarbonate resin, (A-2) about 5 wt % to about 15 wt % of a polybutylene terephthalate resin, (A-3) about 5 wt % to about 20 wt % of a methyl methacrylate-styrene-acrylonitrile copolymer, and (A-4) greater than about 0 wt % and less than or equal to about 10 wt % of an aromatic vinyl compound-vinyl cyanide compound copolymer; and (B) about 5 parts by weight to about 10 parts by weight of a methyl methacrylate-butadiene-styrene copolymer, and a molded article using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.