Methods of direct cooling of packaged devices and structures formed thereby
US10228735B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2017 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | Jun 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16152
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods of forming microelectronic package structures/modules, and structures formed thereby, are described. Structures formed herein may include a die disposed on a substrate; a cooling solution comprising a first surface and a second surface opposite the first surface, wherein the second surface is disposed on a backside of the die disposed on a package substrate. A lid comprising an outer surface is disposed on the first surface of the cooling solution, wherein the lid includes a plurality of fins disposed on an inner surface of the lid. A solder is disposed between the outer surface of the lid and the first surface of the cooling solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.