Moisture-resistant chip scale packaging light-emitting device
US10230027B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 31, 2017 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | Jul 31, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
Abstract
A chip scale packaging (CSP) light-emitting device including a light-emitting semiconductor die and a layer-by-layer photoluminescent (PL) structure disposed on the light-emitting semiconductor die is disclosed. The PL structure includes a second PL layer and a first PL layer disposed over the second PL layer, wherein the first PL layer functions as a photoluminescent layer and a barrier layer protecting the second PL from ambient oxygen and moisture. The first PL layer includes a less-moisture-sensitive PL material dispersed within a first polymer matrix material, whereas the second PL layer includes a moisture-sensitive PL material dispersed within a second polymer material. With these arrangements, the outermost first PL layer comprising the less-moisture-sensitive photoluminescent material functions as a wavelength-conversion layer and also serves as a barrier layer protecting the inner second PL layer comprising the moisture-sensitive photoluminescent material from ambient oxygen and moisture. Thus degradation of moisture-sensitive PL material can be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.