Light emitting device with asymmetrical radiation pattern and manufacturing method of the same
US10230030B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2017 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | Jan 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
Abstract
A monochromatic chip-scale packaging (CSP) light emitting diode (LED) device with an asymmetrical radiation pattern, including a flip-chip LED semiconductor die, and a reflective structure, is disclosed. A white-light broad-spectrum CSP LED device with asymmetrical radiation pattern is also disclosed by further including a photoluminescent structure in the CSP LED device. The photoluminescent structure covers at least the upper surface of the LED semiconductor die. The reflective structure adjacent to the LED semiconductor die and the photoluminescent structure reflects at least partial light beam emitted from the edge surface of the LED semiconductor die or the edge surface of the photoluminescent structure, therefore shaping the radiation pattern asymmetrically. A method to fabricate the aforementioned CSP LED device is also disclosed. Without using additional optical lens, the CSP LED device is suitable for the applications requiring asymmetrical illuminations, while keeping the advantage of its compact form factor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.