Method for making housing
US10230158B2 · kind B2 · utility
1Cited by
3References
7Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jul 25, 2017 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | Aug 16, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q1/425
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A method of making a housing includes providing a substrate having an opening, providing a plurality of metal sheets, providing a plurality of non-conductive members, and bonding the metal sheets together through the non-conductive members, forming a metal sheets member, placing the metal sheets member in the opening, bonding the metal sheets member with the substrate through the non-conductive members, and removing excess parts of the substrate to form the housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.