Modular split-processing infrared imaging system
US10230909B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2017 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | Mar 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/57
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Various techniques are provided to implement a modular infrared imager assembly configured to interface with supporting electronics provided, for example, by a third party. In one example, a system includes an imager assembly comprising a focal plane array configured to capture thermal image data from a scene and output the thermal image data, a printed circuit board assembly, and processing electronics communicatively connected to the focal plane array through the printed circuit board assembly and configured to receive and process the thermal image data. The system further includes a connector communicatively connected to the imager assembly and configured to interface with supporting electronics configured to receive and additionally process the thermal image data.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.