Copper interconnect for PTH components assembly
US10231333B1 · kind B1 · utility
10Cited by
20References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 17, 2014 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | Aug 24, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/321
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods of making a copper interconnect plated through hole assembly are disclosed. Nano copper ink dispersed in an organic solvent is able to be filled in the plated through hole and forming the copper interconnect by sintering at a temperature below the melting of the copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.