Metallic ink

US10231344B2 · kind B2 · utility

Assignees

• Applied Nanotech, Inc. · US
• ISHIHARA CHEMICAL CO., LTD. · JP

Inventors

• Yunjun Li · Austin, US
• David Max Roundhill · Austin, US
• Mohshi Yang · Austin, US
• Igor Pavlovsky · Austin, US
• Richard Lee Fink · Austin, US
• Zvi Yaniv · Austin, US

Key dates

• Filing date: May 15, 2008
• Grant date: Mar 12, 2019
• Expiry date: Dec 18, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K2203/1545
• WIPO field: Materials, metallurgy
• WIPO sector: Chemistry

Abstract

Forming a conductive film comprising depositing a non-conductive film on a surface of a substrate, wherein the film contains a plurality of copper nanoparticles and exposing at least a portion of the film to light to make the exposed portion conductive. Exposing of the film to light photosinters or fuses the copper nanoparticles.